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SiGen in the News
02/29/24
Silicon Genesis continues to extend its NANOCLEAVE™ Layer Transfer Process Technology for 3DIC Integration Using Interconnect Network Layers (“INL”)(PDF 140KB)
12/09/23
Silicon Genesis Broadens the Use of Layer Transfer Methods to Advanced CMOS Image Sensor Stacks(PDF 330KB)
08/31/23
Silicon Genesis Extends its Nanocleave Layer Transfer Technology with New 3DIC Initiatives (PDF 145KB)
03/02/23
3DIC: Silicon Genesis works with its Customers to enhance CMOS Performance by Stacking Wafer Scale Integrated Circuits Vertically using its Proprietary Nanocleave Layer Transfer Techniques (PDF 160KB)
01/27/23
Silicon Genesis continues its focus on Customer Specific 3DIC Applications using its SiGen NanoTec suite of technology offerings and SiGen Nanocleave Layer Transfer Process Technology (PDF 153KB)
04/03/17
Silicon Genesis has focused its Nanocleave Layer Transfer Technology development efforts into the emerging 3DIC application markets (PDF 118KB)