Articles Please select the articles that you are interested in downloading Articles Available "*" indicates required fields Step 1 of 2 50% Untitled Preliminary Steps Towards Implementing Intimate 3D-IC Stacking with Layer Transfer and Atomic Bonding Methods Paper Preliminary Steps Towards Implementing Intimate 3D-IC Stacking with Layer Transfer and Atomic Bonding Methods Poster Layer-Transfer Quality Cleve Principles, July 8, 2005 High Temperature Oxygen Out-Diffusion from the Interfacial SiOx Bond Layer in Direct Silicon Bonded (DSB) Substrates Germanium-on-Insulator Substrates by Wafer Bonding Layer-Transfer Process Modifications for Fabricating Hybrid Crystal Orientation Engineered Substrates Optoelectroinc Substrates by SiGen NanoTec—A General Layer-Transfer (LT) Approach Multi-stack SOI: Processing and characterization highlights Plasma-Activated Bonding, Controlled Cleave Process, and Non-Contact Smoothing for Germanium-on-Insulator (GeOI) Manufacturing Fully Integrated Plasma-Activated Bonding (PAB) for High Volume SOI Substrate Manufacturing Process Plasma Activated Bonding For Silicon on Glass (SOG) Options at the 45nm node include engineered substrates Layer-Transfer Quality Cleave Principles Ultra-thin SOI Wafer Fabrication Technologies for Fully Depleted CMOS NanoCleave® Application to Three Dimensional Integrated Circuits (3D ICs) Article Download, Step 2 Please fill out this brief form to receive your requested articles. Required items are marked with a red asterisk (*)Market (choose one) Semiconductor Display Optoelectronic Other Project stage (choose one) Early development Investigation Pre-production Other Area of Interest (select all that apply) Performance Cost Power Dissipation Power Dissipation Yields Section BreakTitle* Mr. Mrs. Ms. Dr. First Name* Last Name* Organization/Company name* Country Please SelectAfghanistanAlbaniaAlgeriaAmerican SamoaAndorraAngolaAnguillaAntarcticaAntigua and BarbudaArgentinaArmeniaArubaAustraliaAustriaAzerbaijanBahamasBahrainBangladeshBarbadosBelarusBelgiumBelizeBeninBermudaBhutanBoliviaBonaire, Sint Eustatius and SabaBosnia and HerzegovinaBotswanaBouvet IslandBrazilBritish Indian Ocean TerritoryBrunei DarussalamBulgariaBurkina FasoBurundiCabo VerdeCambodiaCameroonCanadaCayman IslandsCentral African RepublicChadChileChinaChristmas IslandCocos IslandsColombiaComorosCongoCongo, Democratic Republic of theCook IslandsCosta RicaCroatiaCubaCuraçaoCyprusCzechiaCôte d'IvoireDenmarkDjiboutiDominicaDominican RepublicEcuadorEgyptEl SalvadorEquatorial GuineaEritreaEstoniaEswatiniEthiopiaFalkland IslandsFaroe IslandsFijiFinlandFranceFrench GuianaFrench PolynesiaFrench Southern TerritoriesGabonGambiaGeorgiaGermanyGhanaGibraltarGreeceGreenlandGrenadaGuadeloupeGuamGuatemalaGuernseyGuineaGuinea-BissauGuyanaHaitiHeard Island and McDonald IslandsHoly SeeHondurasHong KongHungaryIcelandIndiaIndonesiaIranIraqIrelandIsle of ManIsraelItalyJamaicaJapanJerseyJordanKazakhstanKenyaKiribatiKorea, Democratic People's Republic ofKorea, Republic ofKuwaitKyrgyzstanLao People's Democratic RepublicLatviaLebanonLesothoLiberiaLibyaLiechtensteinLithuaniaLuxembourgMacaoMadagascarMalawiMalaysiaMaldivesMaliMaltaMarshall IslandsMartiniqueMauritaniaMauritiusMayotteMexicoMicronesiaMoldovaMonacoMongoliaMontenegroMontserratMoroccoMozambiqueMyanmarNamibiaNauruNepalNetherlandsNew CaledoniaNew ZealandNicaraguaNigerNigeriaNiueNorfolk IslandNorth MacedoniaNorthern Mariana IslandsNorwayOmanPakistanPalauPalestine, State ofPanamaPapua New GuineaParaguayPeruPhilippinesPitcairnPolandPortugalPuerto RicoQatarRomaniaRussian FederationRwandaRéunionSaint BarthélemySaint Helena, Ascension and Tristan da CunhaSaint Kitts and NevisSaint LuciaSaint MartinSaint Pierre and MiquelonSaint Vincent and the GrenadinesSamoaSan MarinoSao Tome and PrincipeSaudi ArabiaSenegalSerbiaSeychellesSierra LeoneSingaporeSint MaartenSlovakiaSloveniaSolomon IslandsSomaliaSouth AfricaSouth Georgia and the South Sandwich IslandsSouth SudanSpainSri LankaSudanSurinameSvalbard and Jan MayenSwedenSwitzerlandSyria Arab RepublicTaiwanTajikistanTanzania, the United Republic ofThailandTimor-LesteTogoTokelauTongaTrinidad and TobagoTunisiaTurkmenistanTurks and Caicos IslandsTuvaluTürkiyeUS Minor Outlying IslandsUgandaUkraineUnited Arab EmiratesUnited KingdomUnited StatesUruguayUzbekistanVanuatuVenezuelaViet NamVirgin Islands, BritishVirgin Islands, U.S.Wallis and FutunaWestern SaharaYemenZambiaZimbabweÅland Islands Country Email* Commentshttps://gvm.836.myftpupload.com/wp-content/uploads/2023/11/SiGen_DSB_WP.pdfEmailThis field is for validation purposes and should be left unchanged. SEMICONDUCTOR -Business Model PRODUCTS - Overview - SPA Tool - DB&C Tool - IP Licensing TECHNOLOGY - Foundational Technology - Layer Transfer - NanoTec™- Articles - Presentations MARKETS - Overview - Semiconductor - Silicon-on-Insulator - Direct Silicon Bond - Display Market - Optoelectronic Market