SIGEN was founded in September 1997 as an IP company. The company opened its R&D Center in Campbell, California, and embarked on a program to build the process technology and equipment infrastructure needed to fabricate engineered and substrate solutions

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Soon thereafter, SiGen developed and demonstrated a core set of leading-edge processes for Silicon-on-insulator (SOI) wafer fabrication using innovations such as plasma-activated bonding and room-temperature cleaving. The company completed a pilot production facility in 2000 to demonstrate its technology capabilities. After successfully introducing its technology and completing its first major commercial license in 2004, SiGen made the transition to begin a fabless IP licensor and equipment provider for its engineered substrate solutions covering the 200mm/300mm market.